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  • HYPREZ® Process Development - Wafer Processing

    If you are looking for technical support and expertise in the polishing and thinning of advanced material wafers - We have just what you’re looking for!

    In this laboratory we use Engis’ systems approach of diamond superabrasive technology to partner with manufacturers and researchers in solving the technical challenges posed by processing the multitude of new wafer substrate materials now being used in the production environment. We have already developed processes for:


    Silicon Carbide
        Optical Components (LiNbO3, CaF2, MgF2, Si, Ge, KTP, DKDP, etc.)

        Planarization of MEMS Structures

    Gallium Nitride
        Semiconductor Materials (InP, GaSb, InSb, SoS, Ge, etc.)

    Zygo scan of the surface finish of a polished part.

    Our laboratory-based solution development provides you with real benefits in terms of shorter cycle times, reduced overall consumables costs and a shortened CMP process step due to better semi-finishing processes. It also enables you to move to a “greener”, more eco-friendly production process through a reduced level of consumables and, therefore, waste disposal. This is achieved by using water-soluble, easily-cleaned diamond slurries and non-freezing CMP slurries which are less prone to crystallization, while, at the same time maintaining and even enhancing production levels.

    Engis offers our complete systems approach to the processing of Advanced Material Wafers.

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    Give us the opportunity to provide you with the best Process Development, Sales and Customer Support in the industry.
    Contact your local Engis
    Regional Sales Manager or Customer Service Representative.

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         Engis Corporation   •   105 West Hintz Road   •   Wheeling, Illinois 60090   •   Call: +1-847-808-9400   •   Fax: +1-847-808-9430Engis CorporationEngis CorporationEngis Corporation
    Engis Corporation
    Engis Corporation