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  • Horizontal Grinding Machines for Advanced Material Wafers


    • http://www.engis.com/photos/horizontal-grinder-1.jpg

      Machine 1
    • http://www.engis.com/photos/horizontal-grinder-2.jpg

      Machine 2

    The Engis EHG Horizontal Grinding machines are the perfect companion when back-thinning or preparing wafers such as sapphire, silicon carbide and gallium nitride. These unique systems are designed to economically surface grind, as well as back-side grind, LED wafers to the highest level of flatness and surface finish, saving time and labor costs.

    Key Features
    • PLC Based 12” Touch Screen Control Panel

    • Independent Control of Grinding Wheel and Work
      Piece Rotation
    • Fixed or Oscillating Grinding Wheel Function
    • Automatic Tool Wear Compensation
    • Automatic Measuring and Thickness Control
    • Data Management Capable

    Additional Benefits
    • User friendly set-up
    • Easy wheel changing
    • Rapid stock removal
    • Increased throughput
    • Compatible with 24” lapping machine

    Contact Engis
    Download Brochure -
    EHG 250

    Download Brochure -
    EHG 180

    Download Full Lapping Products Catalog
    Lapping Machines & Accessories
    Hyprez Consumables Products
    Process Development Assistance
    Submit Application Data


    Machine Structure of the EHG-250NC
    • The rigid structure provides years of trouble-free operation
    • It’s the perfect tool to thin down parts prior to lapping & polishing
    • Available with in-process thickness feedback

      Specifications
    EHG180 EHG250
    Machine Dimensions (in/mm): 53.5” (W) x 31.5” (D) x 60” (H)
    1,360mm (W) x 800mm (D) x 1,515mm (H)
    57” (W) x 39” (D) x 63” (H)
    1,450mm (W) x 1,000mm (D) x 1,600mm (H)
    Wheel Speed (variable): 1,500 RPM 3,000 RPM
    Work Speed (fixed): 400 RPM 400 RPM
    Maximum Work Size (in/mm): 7” x 2” / 180mm x 50mm 9.8” x 4” / 250mm x 100mm
    Wheel Motor: 220 VAC, 3-Phase, 0.40kW, 50/60 Hz 220 VAC, 3-Phase, 1.50 kW, 50/60 Hz
    Accuracy: Within + 1µm Within + 0.5µm
    Wheel Size: Ø180mm O.D. x 60mm I.D. Ø250mm O.D. x 170mm I.D.
    Part Size - Thickness: Up to 2” / 50mm Up to 4” / 100mm
    Part Size - Diameter: Up to 7” / 180mm Up to 9.8” / 250mm
    Weight: 1,763 lbs (800 kg) 2,646 lbs (1,200 kg)
    Electrical Service: 220 VAC, 3-Phase, 50/60 Hz, 20Amp 220 VAC, 3-Phase, 50/60 Hz, 20Amp
    Air Line Required: 0.6 MPa 0.65 MPa
    OPTIONS:             • Chiller unit
                • Cartridge filter & flow sensor
                • Magnetic chuck
                • Thickness sensor
                • Grinding wheels
                • Chiller unit
                • Cartridge filter & flow sensor
                • Magnetic chuck
                • Thickness sensor
                • Grinding wheels
    EHG180 Brochure EHG250 Brochure

    Give us the opportunity to provide you with the best Process Development, Sales and Customer Support in the industry.
    Contact your local Engis
    Regional Sales Manager or Customer Service Representative.


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