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    Double Sided Grinding Machines
    Engis Corporation

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    Double Sided Grinding Machines
    Engis Corporation
    Engis Corporation Engis Corporation

    This double sided grinding machine can be used on a variety of materials to achieve a high degree of accuracy in flatness, parallelism and surface finish. Designed for use with Engis diamond plates, the Engis double sided grinding machine reduces your processing time, as well as overall cost.

    This unique grinding machine is suitable for your double sided lapping applications using either
    free abrasive slurries or for your fine grinding processes with fixed abrasive media.

    Applications for this Double Sided Grinding Machine Include:
    • Tungsten carbide
    • MLCC
    • Hard metal
    • Ceramic Substrate
    • Composites
    • NTC Substrate
    • Aluminum
    • Ferrite
    • Silicon Carbide
    • Sapphire….and others
    • Optical Glasses
    • Sinter metal
    • Zirconium
    • Engineered Plastics
    • Bronze
    • PZT Substrate
    • Diamond Dicing Blade
    • Quartz
    • Crystal

    Contact Engis
    Download Full Lapping Product Catalog
    Lapping Machines & Accessories
    Hyprez Slurry and Lubes
    Hyprez Lapping Plates
    Process Development Assistance
    Submit Application Data
    Key Features
    •  Digital size controller assures reliability
    •  Rigid body ensures no vibration for added accuracy
    •  Real 3-way system features Upper and Lower wheel drives
    •  Sun Gear is driven by independently geared motor with AC inverter
    •  Soft touch screen makes operation simple and user friendly
    •  Pre, main and post load position is controlled by simple setting
    •  Upper wheel swivel provides operator with more space for loading and unloading

    Contact your local Engis Regional Sales Manager or Customer Service Representative. to get more information.

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